Wieland

Wieland MicroCool is an industry leader in base plate, cold plate and total cooling loop system designs. Wieland offers a myriad of fin and custom pin fin geometries designed to improve reliability and thermal efficiency in cooling electronic systems. These unique cold plates maximize thermal and pressure drop performance due to enhanced surface area, high fin density and distinctive micro-channel construction.

Headquartered in Decatur, Alabama, Wieland has been able to leverage years of liquid cooling know how to address new thermal management solutions for computer systems and high-performance power electronics. Wieland's Micro Deformation Technology (MDT), a proprietary material forming process originally developed for the production of surface-enhanced heat transfer tubing, has revolutionized liquid cooling in electronic systems by delivering superior thermal performance to customers around the world. Wieland's surface technology offers the OEM engineer and system integrator the optimum in design flexibility while maximizing both thermal performance and pressure drop.

Weiland Products

Cold Plate Products

Weiland design and manufacture the best performing and most cost effective cold plates for liquid cooling available today. Weiland’s innovative cold plates use the patented Micro Deformation Technology (MDT™) inside and typically feature friction stir welded (FSW) construction however other joining methods such as vacuum brazing are available.

3000 series: Cost effective series extruded tub/manifold with friction stir welded MDT pin fin plates

4000 series: High Performance new generation of extruded tub/manifolds offer larger flow paths in a more compact footprint. They feature the same friction stir welded MDT pin fin plates in a package with lower pressure drop and more flexibility.

Custom: Castings, extrusions, copper, double sided, light weight, large/multiple module cold plates, etc.

Weiland cold plates are designed for: high power electronics, inverters, DC-DC converters, wind inverters, solar inverters, automotive, hybrid and electric vehicles, waste heat recovery, thermal electric (TEC), MRI amplifiers, power supplies, variable speed drives, locomotive, traction drives, agriculture machinery, lasers, RF amplifiers, data center, CPU, GPU, and chillers.