Multi-Chip Package (MCP) memory product family consists of a 1.8V NAND Flash Memory device combined with a 1.8V Low Power SDRAM device in one package to provide the most space effective solution for saving area on the PCB (Printed Circuit Board). This benefit becomes more critical in small PCBs for modules and space critical designs particularly for mobile and portable applications.
| Winbond Part | Memory Combination | Ball | Package Size | Density Flash | Density DRAM | I/O Bus Flash | I/O Bus DRAM | DRAM Type | Packages |
|---|---|---|---|---|---|---|---|---|---|
| W71NW20GF3FW | NAND + LPDDR2 | 162 | 8x10.5x1.0 | 2Gb | 1Gb | 8 | 32 | LPDDR2 | 8x10.5x1.0 |
| W71NW11HC1DW | NAND + LPDDR | 130 | 8x9x1.0 | 1Gb | 512Mb | 16 | 16 | LPDDR1 | 8x9x1.0 |
| W71NW11GF1EW | NAND + LPDDR2 | 121 | 8x8x0.8 | 1Gb | 1Gb | 16 | 16 | LPDDR2 | 8x8x0.8 |
| W71NW11GE1EW | NAND + LPDDR2 | 121 | 8x8x0.8 | 1Gb | 512Mb | 16 | 16 | LPDDR2 | 8x8x0.8 |
| W71NW10GF3FW | NAND + LPDDR2 | 162 | 8x10.5x1.0 | 1Gb | 1Gb | 8 | 32 | LPDDR2 | 8x10.5x1.0 |
| W71NW10GE3FW | NAND + LPDDR2 | 162 | 8x10.5x1.0 | 1Gb | 512Mb | 8 | 32 | LPDDR2 | 8x10.5x1.0 |
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