Winbond Changes the Game with HyperRAM for Automotive, IoT and Industrial Applications

Winbond HyperRAM™ products provide a compact alternative to traditional pseudo-SRAM in IoT and consumer devices, automotive and industrial equipment. The introduction in 2021 of HyperRAM™ devices produced on Winbond’s 25nm process extends densities up to 256Mb and 512Mb.

Winbond’s Hybrid Sleep Mode (HSM) gives standby power consumption as low as 45μW, and operating power less than half that of equivalent pSRAM products.

HyperRAM™ devices use just 13 signal pins, compared to 31 signal pins in pSRAM. This makes the board layout much simpler to design and manufacture.

Low pin-count packages and a lower number of connections to the host controller reduce the memory system’s board footprint and save space in consumer devices such as smart watches.