GeneSiC Semiconductor

The advantage of these products is improved circuit efficiency (lower overall cost), low switching losses, ease of paralleling devices without thermal runaway, smaller heat sink requirements, low reverse recovery current, low device capacitance, and low reverse leakage current at operating temperature

Applications:

• Switched Mode Power Supply (SMPS)
• Solar Inverter
• Server and Telecom Power Supply
• High Frquency Converters
• Uninterruptible Power Supply (UPS)

GeneSiC thrives to deliver the best customer driven designs possible by providing SiC power devices with superior cost-performance index, high ruggedness and high quality.

Applications:

• Boost Diode in Power Factor Correction (PFC)
• Switched Mode Power Supply (SMPS)
• Extreme Fast Charging Infrastructure
• Solar Inverters and Energy Storage
• Data Center Power Supplies

Features include 15kV blocking technology with 175°C operating temperatures for fast turn off characteristics, others include soft reverse recovery characteristics, and ultrafast high temp. switching.

Applications:

• Voltage Multiplier
• Ignition/Trigger Circuits
• Oil/Downhole
• Lighting
• Defense

Features include 15kV blocking technology with 175°C operating temperatures for fast turn off characteristics, others include soft reverse recovery characteristics, and ultrafast high temp. switching.

Applications:

• Voltage Multiplier
• Ignition/Trigger Circuits
• Oil/Downhole
• Lighting
• Defense

Features include 175°C Maximum operating temperature with Gate Oxide free SiC switch, Optional gate return Pin.

Applications:

• Down Hole Oil Drilling.
• Hybrid Electric Vehicles(HEV)
• Solar Inverters
• Switched-Mode Power Supply (SMPS)
• Power Factor Correction (PFC)

Features include 175°C Maximum operating temperature with Gate Oxide free SiC switch, Optional gate return Pin.

Applications:

• Down Hole Oil Drilling.
• Hybrid Electric Vehicles(HEV)
• Solar Inverters
• Switched-Mode Power Supply (SMPS)
• Power Factor Correction (PFC)

Features include 175°C Maximum operating temperature with Gate Oxide free SiC switch, Optional gate return Pin.

Applications:

• Down Hole Oil Drilling.
• Hybrid Electric Vehicles(HEV)
• Solar Inverters
• Switched-Mode Power Supply (SMPS)
• Power Factor Correction (PFC)

Applications:

Features include low Forward voltages with high surge overload ratings. Ideal for printed circuit boards and high temperature soldering: 260°C/10 s.

• Switching power supply
• Home appliances, office devices
• Industrial auto-equipments
• Types Ranging from 50V up to 400 V
• Not ESD Sensitve

Applications:

This product is ideal for printed circuit boards. Reliable low cost constuction utilizing molded plastic technique, with high surge current capabilities.

• High Surge Current Capabilities
• Small size Simple installation
• Types from 50 V up to 400 V
• Not ESD Sensitive
• Reliable low cost of construction

Applications:

This series inlcudes Expoxy resin material compliant with 94V-0 standards of UL material flammability provisions. And Compiant with RoHS provisions.

• Single in-line DIP package, compact size
• Low Forward voltage, high forward current
• High surge current capability.
• Types from 100V to 400 V.
• Thermal welding performace 260°C/10s

Applications:

This series include plastic packages has underwriters laboratory flammability classifications 94V-0. This series is UL listed under the Recognied.

• Single in-line DIP package, compact size
• Low Forward voltage, high forward current
• High surge current capability.
• Types from 100V to 400 V.
• Thermal welding performace 260°C/10s

Applications:

Features include surge overload rating 80 amperes peak and high reliability, ideal for printed curcuit boards.

• Halogen free available upon request by adding suffix "-HF"
• Epoxy meets UL 94 V-0 flammablility rating
• Moisture Sensitivity Level 1
• Lead Free Finish / RoHS compliant.
• High Reliability

Applications:

Features include integrally molded heat-sink provided very low thermal resistance for maximum heat dissipation.

• Surge Overland ratings fomr 300 A to 400 A
• Isolated voltage from case to lead over 2500 V
• UL Certified
• Terminals finish material
• Mounting torque 20 in-lbs maximum.

Applications:

Features include Epoxy Resin material compliant with 94V-0 standards of UL UL material flammability provisions.

• Ideal for printed circuit boards
• High surge overload rating
• High temperature soldering guaranteed: 260C /10 seconds.
• Expoy Resin material compliant with 94V-0.
• Not ESD Sensitive.

Applications:

Features include glass passivated die construction, and high case dielectric strength of 1500V

• Low reverse leakage current
• Surge overload rating to 120A peak
• Glass passivated die construction
• Ideal for printed circuit board applications
• UL listed under recognized component index.

Applications:

This series is ideal for printed circuit boards, and have a reliable low cost construction utilizing molded plastic.

• Ideal for printed circuit board
• Reliable low cost construction utilizing molded plastic
• High surge current capabilities
• Silver plated copper leads
• Types from 50 V to 400 V

Applications:

This series is ideal for printed circuit boards, and have a reliable low cost construction utilizing molded plastic.

• Ideal for printed circuit board
• Reliable low cost construction utilizing molded plastic
• High surge current capabilities
• Silver plated copper leads
• Types from 50 V to 400 V

Applications:

Features include Surge overload -240-500 Amperes peak, and low forward voltage drop.

• Surge overload -240-500 amperes peak
• Low forward voltage drop
• Electrically isolated base -2000 Volts
• Materials used carries UL recognition
• Has any mounting position.

Applications:

Features include Glass passivated die construction, and high case dielectric strength of 1,500V.

• UL Recognition
• Ideal for printed circuit boards
• High surge current capability
• Plastic-passivated junction
• High case dielectric strength of 1500V

Applications:

Features include low power loss, and high efficiency. Newer packages provide capablility of inspection and probe after board mounting.

• Low Power Loss/High Efficiency
• Guarding for stress protection
• Low foward voltage drop
• 175 C operating junction temperature
• Wettable flacks option available

Applications:

Features include High surge capabilities and types ranging from 600v all the way up to 1000V.

• High Surge Capability
• Types from 600V to 1000V
• Isolation type package
• Electricakky isolated base plate
• Not ESD Sensitive

Applications:

• High Surge Capabilities
• Types from 400 to 600 V
• Not ESD Sensitive

Applications:

• High Surge Capability
• Types from 20 V to 40 V
• Not ESD Sensitive

Applications:

• High Surge Capability
• Types from 20 V to 40 V
• Not ESD Sensitive

Applications:

• High Surge Capability
• Types from 20 V to 40 V
• Not ESD Sensitive

Applications:

• High surge current capability
• Designed for a wide range of applications
• Stud cathode and stud anode verson